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| (R) STPS745D/F/G/FP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS s s s s 7.5 A 45 V 175 C 0.57 V s VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING INSULATED PACKAGE: ISOWATT220AC, TO-220FPAC Insulating voltage = 2000V DC Capacitance = 12pF AVALANCHE CAPABILITY SPECIFIED A K A K TO-220AC STPS745D K ISOWATT220AC STPS745F DESCRIPTION A Single Schottky rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. Packaged either in TO-220AC, ISOWATT220AC, TO-220FPAC or D2PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) RMS forward current Average forward current = 0.5 Parameter Repetitive peak reverse voltage NC A K D2PAK STPS745G TO-220FPAC STPS745FP Value 45 20 Unit V A A TO-220AC / D2PAK ISOWATT220AC/ TO-220FPAC Tc = 160C Tc = 145C 7.5 IFSM IRRM IRSM PARM Tstg Tj dV/dt *: Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range tp = 10 ms sinusoidal tp = 2 s square tp = 1s F = 1kHz tp = 100 s square Tj = 25C 150 1 2 2700 - 65 to + 175 175 10000 A A A W C C V/s Maximum operating junction temperature * Critical rate of rise of reverse voltage dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a ) 1/7 July 2003 - Ed: 6G STPS745D/F/G/FP THERMAL RESISTANCES Symbol Rth (j-c) Parameter Junction to case TO-220AC / D2PAK ISOWATT220AC/ TO-220FPAC Value 3.0 5.5 Unit C/W STATIC ELECTRICAL CHARACTERISTICS Symbol IR * Parameter Reverse leakage current Tests Conditions Tj = 25C Tj = 125C VF * Forward voltage drop Tj = 125C Tj = 25C Tj = 125C Pulse test : * tp = 380 s, < 2% Min. Typ. Max. 100 Unit A mA V VR = VRRM 5 IF = 7.5 A IF = 15 A IF = 15 A 0.65 0.5 15 0.57 0.84 0.72 To evaluate the conduction losses use the following equation : P = 0.42 x IF(AV) + 0.020 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. PF(av)(W) 6 5 4 3 2 1 IF(av) (A) 0 0 1 2 3 4 5 6 7 =tp/T T Fig. 2: Average current temperature ( = 0.5). IF(av)(A) versus ambient = 0.1 = 0.05 = 0.2 = 0.5 =1 tp 8 9 10 9 8 7 6 5 4 3 2 1 0 Rth(j-a)=Rth(j-c) TO-220AC ISOWATT220AB Rth(j-a)=15C/W Rth(j-a)=40C/W T =tp/T tp Tamb(C) 50 75 100 125 150 175 0 25 2/7 STPS745D/F/G/FP Fig. 3: Normalized avalanche power derating versus pulse duration. PARM(tp) PARM(1s) 1 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(25C) 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(s) 10 100 1000 Tj(C) 0 0 25 50 75 100 125 150 Fig. 5-1: Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220AC and D2PAK). IM(A) 120 100 80 60 40 IM Fig. 5-2: Non repetitive surge peak forward current versus overload duration (maximum values) (ISOWATT220AC/TO-220FPAC). IM(A) 80 70 60 50 Tc=50C Tc=50C Tc=100C 40 30 20 10 0 1E-3 Tc=100C Tc=150C IM t Tc=150C t 20 0 1E-3 =0.5 t(s) 1E-2 1E-1 1E+0 =0.5 t(s) 1E-2 1E-1 1E+0 Fig. 6-1: Relative variation of thermal transient impedance junction to case versus pulse duration (TO-220AC and D2PAK). Zth(j-c)/Rth(j-c) 1.0 0.8 0.6 0.4 0.2 = 0.2 = 0.1 Single pulse = 0.5 Fig. 6-2: Relative variation of thermal transient impedance junction to case versus pulse duration (ISOWATT220AC/TO-220FPAC). Zth(j-c)/Rth(j-c) 1.0 0.8 0.6 0.4 T = 0.5 T 0.2 tp(s) 1E-3 1E-2 =tp/T tp = 0.2 = 0.1 Single pulse tp(s) 0.0 1E-4 =tp/T tp 1E-1 1E+0 0.0 1E-3 1E-2 1E-1 1E+0 1E+1 3/7 STPS745D/F/G/FP Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). IR(A) 5E+4 1E+4 1E+3 1E+2 1E+1 Tj=25C Tj=150C Tj=125C Tj=100C Tj=75C Tj=50C Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(pF) 1000 F=1MHz Tj=25C 500 200 VR(V) 30 35 40 45 1E+0 VR(V) 1E-1 0 5 10 15 20 25 100 1 2 5 10 20 50 Fig. 9: Forward voltage drop versus forward current (maximum values). IFM(A) 100.0 Tj=125C Typical values Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35m). Rth(j-a) (C/W) 80 70 60 10.0 Tj=25C 50 40 Tj=125C 1.0 VFM(V) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 30 20 10 0 0 2 4 6 S(Cu) (cm) 8 10 12 14 16 18 20 4/7 STPS745D/F/G/FP PACKAGE MECHANICAL DATA D2PAK (Plastic) DIMENSIONS REF. A E L2 C2 Millimeters Min. Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 8 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 0 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 0 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 8 A A1 D A2 B B2 L L3 A1 B2 B G A2 C R C C2 D E G L M * L2 V2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0.016 typ. FOOTPRINT DIMENSIONS (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 5/7 STPS745D/F/G/FP PACKAGE MECHANICAL DATA TO-220FPAC DIMENSIONS REF. A H B Millimeters Min. Max. 4.4 4.6 2.5 2.7 2.5 2.75 0.45 0.70 0.75 1 1.15 1.70 4.95 5.20 2.4 2.7 10 10.4 16 Typ. 28.6 30.6 9.8 10.6 2.9 3.6 15.9 16.4 9.00 9.30 3.00 3.20 Inches Min. Max. 0.173 0.181 0.098 0.106 0.098 0.108 0.018 0.027 0.030 0.039 0.045 0.067 0.195 0.205 0.094 0.106 0.393 0.409 0.63 Typ. 1.126 1.205 0.386 0.417 0.114 0.142 0.626 0.646 0.354 0.366 0.118 0.126 Dia L6 L2 L3 L5 D F1 L4 L7 F G1 G E A B D E F F1 G G1 H L2 L3 L4 L5 L6 L7 Dia. PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS REF. A C D L7 Millimeters Min. Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 14.00 2.95 15.75 6.60 3.93 3.85 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 13.00 2.65 15.25 6.20 3.50 3.75 Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 0.511 0.104 0.600 0.244 0.137 0.147 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 0.551 0.116 0.620 0.259 0.154 0.151 H2 C L5 OI L6 L2 D A E F F1 G H2 L2 L9 F1 L4 16.40 typ. 0.645 typ. F G M E L4 L5 L6 L7 L9 M Diam. I 2.6 typ. 0.102 typ. 6/7 STPS745D/F/G/FP PACKAGE MECHANICAL DATA ISOWATT220AC A H B DIMENSIONS REF. A B D L7 Millimeters Min. Typ. Max. 4.60 2.70 2.75 0.70 1.00 1.70 5.20 16.00 28.60 15.90 9.00 3.00 30.60 1.125 16.40 0.626 9.30 3.20 0.354 0.118 Min. 0.173 0.098 0.094 0.016 0.030 0.045 0.195 4.40 2.50 2.40 0.40 0.75 1.15 4.95 10.00 Inches Typ. Max. 0.181 0.106 0.108 0.028 0.039 0.067 0.205 0.409 0.630 1.205 0.646 0.366 0.126 L6 L2 L3 Diam E F F1 G H L2 L3 L6 L7 Diam F1 10.40 0.394 F G D E Type STPS745D STPS745F STPS745G STPS745G-TR STPS745FP s s s s Marking STPS745D STPS745F STPS745G STPS745G STPS745FP Package TO-220AC ISOWATT220AC D2PAK D2PAK TO-220FPAC Weight 1.86 g. 2 g. 1.48 g. 1.48 g. 1.9 g. Base qty 50 50 50 1000 50 Delivery mode Tube Tube Tube Tape & reel Tube Cooling method: by conduction (C) Recommended torque value: 0.55 N.m Maximum torque value: 0.7 N.m. Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 7/7 |
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